Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6977349 | Method for manufacturing wiring circuit boards with bumps and method for forming bumps | Keiichi Naito, Toshihiro Shinohara | 2005-12-20 |
| 6930390 | Flexible printed wiring boards | Akira Tsutsumi, Hiroyuki Hishinuma | 2005-08-16 |