Issued Patents 2005
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6939448 | Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces | Robert W. Batz, Jr., John M. Pedersen, John L. Klocke | 2005-09-06 |
| 6932892 | Apparatus and method for electrolytically depositing copper on a semiconductor workpiece | Thomas C. Taylor | 2005-08-23 |
| 6919013 | Apparatus and method for electrolytically depositing copper on a workpiece | — | 2005-07-19 |
| 6911127 | Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces | Robert W. Batz, Jr., John M. Pedersen, John L. Klocke | 2005-06-28 |
| 6908851 | Corrosion resistance for copper interconnects | Yaojian Leng | 2005-06-21 |
| 6899805 | Automated chemical management system executing improved electrolyte analysis method | Lyndon Graham | 2005-05-31 |
| 6869510 | Methods and apparatus for processing the surface of a microelectronic workpiece | Daniel J. Woodruff, Kyle M. Hanson, Thomas H. Oberlitner, John M. Pedersen, Vladimir Zila | 2005-03-22 |