Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6852625 | Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same | Chong-Ho Kim, Tae-Gui Kim | 2005-02-08 |
YS
Young-Hwan Shin
Overall (2005): #70,197 of 245,428Top 30%
1
Patents 2005