Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6872590 | Package substrate for electrolytic leadless plating and manufacturing method thereof | Jong Jin Lee | 2005-03-29 |
| 6852625 | Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same | Young-Hwan Shin, Chong-Ho Kim | 2005-02-08 |