Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6852625 | Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same | Young-Hwan Shin, Tae-Gui Kim | 2005-02-08 |
CK
Chong-Ho Kim
Overall (2005): #224,466 of 245,428Top 95%
1
Patents 2005