Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6905959 | Apparatus and method for depositing superior Ta (N) copper thin films for barrier and seed applications in semiconductor processing | Maximilian A. Biberger, Erich R. Klawuhn, Kwok Fai Lai, Karl B. Levy, J. Patrick Rymer | 2005-06-14 |