Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6969557 | Surface-treated copper foil low-dielectric substrate and copper-clad laminate and printed wiring board using the same | Mitsuyoshi Matsuda | 2005-11-29 |
| 6902824 | Copper foil and metal foil with carrier foil for printed wiring board, and semi-additive process for producing printed wiring board using the same | Takuya Yamamoto, Yutaka Hirasawa, Naotomi Takahashi | 2005-06-07 |