Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6969557 | Surface-treated copper foil low-dielectric substrate and copper-clad laminate and printed wiring board using the same | Takashi Kataoka | 2005-11-29 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6969557 | Surface-treated copper foil low-dielectric substrate and copper-clad laminate and printed wiring board using the same | Takashi Kataoka | 2005-11-29 |