Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6902824 | Copper foil and metal foil with carrier foil for printed wiring board, and semi-additive process for producing printed wiring board using the same | Takuya Yamamoto, Takashi Kataoka, Yutaka Hirasawa | 2005-06-07 |
| 6839219 | Laminate for forming capacitor layer and method for manufacturing the same | Yasuaki Mashiko, Hideshi Sekimori | 2005-01-04 |