Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6962864 | Wire-bonding method for chips with copper interconnects by introducing a thin layer | Sang-Mao Chiu | 2005-11-08 |
| 6886735 | Method of thermosonic wire bonding process for copper connection in a chip | Chang Wang | 2005-05-03 |