Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6962864 | Wire-bonding method for chips with copper interconnects by introducing a thin layer | Yeau-Ren Jeng | 2005-11-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6962864 | Wire-bonding method for chips with copper interconnects by introducing a thin layer | Yeau-Ren Jeng | 2005-11-08 |