CW

Chang Wang

NU National Chung Cheng University: 1 patents #9 of 21Top 45%
📍 White Plains, NY: #18 of 46 inventorsTop 40%
🗺 New York: #2,313 of 8,003 inventorsTop 30%
Overall (2005): #221,778 of 245,428Top 95%
1
Patents 2005

Issued Patents 2005

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6886735 Method of thermosonic wire bonding process for copper connection in a chip Yeau-Ren Jeng 2005-05-03