HW

Huey-Ming Wang

EI Ebara Technologies Incorporated: 2 patents #1 of 4Top 25%
MI Multiplanar Technologies Incorporated: 2 patents #3 of 9Top 35%
📍 Ballston Lake, NY: #4 of 34 inventorsTop 15%
🗺 New York: #382 of 8,003 inventorsTop 5%
Overall (2005): #12,172 of 245,428Top 5%
4
Patents 2005

Issued Patents 2005

Showing 1–4 of 4 patents

Patent #TitleCo-InventorsDate
6966822 System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control Jiro Kajiwara, Gerard Moloney, David A. Hansen, Alejandro Reyes 2005-11-22
6916226 Chemical mechanical polishing apparatus having a stepped retaining ring and method for use thereof Gerard Moloney 2005-07-12
6913514 Chemical mechanical polishing endpoint detection system and method Norio Kimura, Masayuki Kumekawa 2005-07-05
6893327 Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface Jiro Kajiwara, Gerard Moloney, Junsheng Yang 2005-05-17