Issued Patents 2005
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6966822 | System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control | Jiro Kajiwara, Huey-Ming Wang, David A. Hansen, Alejandro Reyes | 2005-11-22 |
| 6916226 | Chemical mechanical polishing apparatus having a stepped retaining ring and method for use thereof | Huey-Ming Wang | 2005-07-12 |
| 6893327 | Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface | Jiro Kajiwara, Huey-Ming Wang, Junsheng Yang | 2005-05-17 |
| 6887132 | Slurry distributor for chemical mechanical polishing apparatus and method of using the same | Jiro Kajiwara, Jun Liu, Junsheng Yang, Ernesto Saldana, Cormac Walsh +1 more | 2005-05-03 |