Issued Patents 2005
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6957760 | Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux | Chad A. Cobbley, Marjorie L. Waddel | 2005-10-25 |
| 6956294 | Apparatus for routing die interconnections using intermediate connection elements secured to the die face | — | 2005-10-18 |
| 6949158 | Using backgrind wafer tape to enable wafer mounting of bumped wafers | Jose Sanchez | 2005-09-27 |
| 6886734 | Device and method for clamping and wire-bonding the leads of a lead frame one set at a time | Rich Fogal | 2005-05-03 |
| 6884657 | Angularly offset stacked die multichip device and method of manufacture | Rich Fogal | 2005-04-26 |
| 6861345 | Method of disposing conductive bumps onto a semiconductor device | Chad A. Cobbley | 2005-03-01 |
| 6845898 | Bondhead lead clamp apparatus | Rich Fogal | 2005-01-25 |
| 6844216 | Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux | Chad A. Cobbley, Marjorie L. Waddel | 2005-01-18 |
| 6837418 | Bondhead lead clamp apparatus and method | Rich Fogal | 2005-01-04 |