Issued Patents 2005
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6886734 | Device and method for clamping and wire-bonding the leads of a lead frame one set at a time | Michael B. Ball | 2005-05-03 |
| 6884657 | Angularly offset stacked die multichip device and method of manufacture | Michael B. Ball | 2005-04-26 |
| 6845898 | Bondhead lead clamp apparatus | Michael B. Ball | 2005-01-25 |
| 6837418 | Bondhead lead clamp apparatus and method | Michael B. Ball | 2005-01-04 |