Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6957760 | Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux | Chad A. Cobbley, Michael B. Ball | 2005-10-25 |
| 6844216 | Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux | Chad A. Cobbley, Michael B. Ball | 2005-01-18 |