Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6979600 | Apparatus and methods for an underfilled integrated circuit package | — | 2005-12-27 |
| 6867978 | Integrated heat spreader package for heat transfer and for bond line thickness control and process of making | Kris Whittenburg, Fay Hua, Carl Deppisch, Sabina J. Houle, Kim Phillippe | 2005-03-15 |