Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6867978 | Integrated heat spreader package for heat transfer and for bond line thickness control and process of making | Kris Whittenburg, Carl Deppisch, Sabina J. Houle, Peter Brandenburger, Kim Phillippe | 2005-03-15 |
| 6857557 | Low temperature microelectronic die to substrate interconnects | — | 2005-02-22 |
| 6848172 | Device and method for package warp compensation in an integrated heat spreader | Thomas J. Fitzgerald, Carl Deppisch | 2005-02-01 |