Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6867978 | Integrated heat spreader package for heat transfer and for bond line thickness control and process of making | Fay Hua, Carl Deppisch, Sabina J. Houle, Peter Brandenburger, Kim Phillippe | 2005-03-15 |