Issued Patents 2005
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6974723 | Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials | James C. Matayabas, Jr., Ashay Dani, Christopher L. Rumer | 2005-12-13 |
| 6926955 | Phase change material containing fusible particles as thermally conductive filler | Saikumar Jayaraman, Ashay Dani | 2005-08-09 |
| 6924027 | Phase change thermal interface materials including exfoliated clay | James C. Matayabas, Jr. | 2005-08-02 |
| 6841867 | Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials | James C. Matayabas, Jr., Ashay Dani, Christopher L. Rumer | 2005-01-11 |
| 6837306 | Carbon-carbon and/or metal-carbon fiber composite heat spreaders | Sabina J. Houle, Greg M. Chrysler | 2005-01-04 |