Issued Patents 2005
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6974723 | Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials | Paul A. Koning, Ashay Dani, Christopher L. Rumer | 2005-12-13 |
| 6974728 | Encapsulant mixture having a polymer bound catalyst | — | 2005-12-13 |
| 6924027 | Phase change thermal interface materials including exfoliated clay | Paul A. Koning | 2005-08-02 |
| 6841867 | Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials | Paul A. Koning, Ashay Dani, Christopher L. Rumer | 2005-01-11 |