Issued Patents 2005
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6974723 | Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials | James C. Matayabas, Jr., Paul A. Koning, Ashay Dani | 2005-12-13 |
| 6924551 | Through silicon via, folded flex microelectronic package | Edward A. Zarbock | 2005-08-02 |
| 6911726 | Microelectronic packaging and methods for thermally protecting package interconnects and components | Saikumar Jayaraman | 2005-06-28 |
| 6892927 | Method and apparatus for bonding a wire to a bond pad on a device | Gregory S. Clemons | 2005-05-17 |
| 6867124 | Integrated circuit packaging design and method | Gregory S. Clemons | 2005-03-15 |
| 6841867 | Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials | James C. Matayabas, Jr., Paul A. Koning, Ashay Dani | 2005-01-11 |