Issued Patents 2005
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6932674 | Method of determining the endpoint of a planarization process | Peter Lahnor, Olaf Kuehn, Andreas Roemer | 2005-08-23 |
| 6899597 | Chemical mechanical polishing (CMP) process using fixed abrasive pads | Peter Wrschka | 2005-05-31 |
| 6893968 | Defect-minimizing, topology-independent planarization of process surfaces in semiconductor devices | Peter Lahnor | 2005-05-17 |
| 6841480 | Polyelectrolyte dispensing polishing pad, production thereof and method of polishing a substrate | Ronald J. Schutz | 2005-01-11 |