Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6890828 | Method for supporting a bond pad in a multilevel interconnect structure and support structure formed thereby | David V. Horak, Charles W. Koburger, III, Peter H. Mitchell | 2005-05-10 |
| 6875685 | Method of forming gas dielectric with support structure | Toshiharu Furukawa, Mark C. Hakey, David V. Horak, Charles W. Koburger, III, Peter H. Mitchell +1 more | 2005-04-05 |