Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6933586 | Porous low-k dielectric interconnects with improved adhesion produced by partial burnout of surface porogens | Ann R. Fornof, Jeffrey Hedrick, Kang-Wook Lee | 2005-08-23 |
| 6864180 | Method for reworking low-k polymers used in semiconductor structures | Darryl D. Restaino, Delores Bennett, John A. Fitzsimmons, John Fritche, Jeffrey Hedrick +2 more | 2005-03-08 |
| 6844257 | Porous low-k dielectric interconnects with improved adhesion produced by partial burnout of surface porogens | Ann R. Fornof, Jeffrey Hedrick, Kang-Wook Lee | 2005-01-18 |