SB

Samson Berhane

HP HP: 1 patents #831 of 2,473Top 35%
📍 Corvallis, OR: #103 of 259 inventorsTop 40%
🗺 Oregon: #705 of 2,197 inventorsTop 35%
Overall (2005): #107,937 of 245,428Top 45%
1
Patents 2005

Issued Patents 2005

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6902872 Method of forming a through-substrate interconnect Diane Lai, Barry C. Snyder, Ronald A. Hellekson, Hubert Vander Plas 2005-06-07