Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6917099 | Die carrier with fluid chamber | Chien-Hua Chen, William Boucher, Joshua W. Smith, David Craig, Gary J. Watts | 2005-07-12 |
| 6902872 | Method of forming a through-substrate interconnect | Diane Lai, Samson Berhane, Barry C. Snyder, Hubert Vander Plas | 2005-06-07 |