BS

Barry C. Snyder

HP HP: 1 patents #831 of 2,473Top 35%
📍 Bend, OR: #11 of 44 inventorsTop 25%
🗺 Oregon: #705 of 2,197 inventorsTop 35%
Overall (2005): #233,145 of 245,428Top 95%
1
Patents 2005

Issued Patents 2005

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6902872 Method of forming a through-substrate interconnect Diane Lai, Samson Berhane, Ronald A. Hellekson, Hubert Vander Plas 2005-06-07