Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6897144 | Cu capping layer deposition with improved integrated circuit reliability | Minh Van Ngo, Paul R. Besser | 2005-05-24 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6897144 | Cu capping layer deposition with improved integrated circuit reliability | Minh Van Ngo, Paul R. Besser | 2005-05-24 |