Issued Patents 2005
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6953998 | Unmolded package for a semiconductor device | — | 2005-10-11 |
| 6949410 | Flip chip in leaded molded package and method of manufacture thereof | Consuelo Tangpuz, Romel N. Manatad | 2005-09-27 |
| 6891256 | Thin, thermally enhanced flip chip in a leaded molded package | Chung-Lin Wu | 2005-05-10 |
| 6867481 | Lead frame structure with aperture or groove for flip chip in a leaded molded package | Chung-Lin Wu | 2005-03-15 |