Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6949410 | Flip chip in leaded molded package and method of manufacture thereof | Rajeev Joshi, Romel N. Manatad | 2005-09-27 |
| 6943434 | Method for maintaining solder thickness in flipchip attach packaging processes | Romel N. Manatad, Margie T. Rios, Erwin Victor Cruz | 2005-09-13 |