Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6943434 | Method for maintaining solder thickness in flipchip attach packaging processes | Consuelo Tangpuz, Romel N. Manatad, Erwin Victor Cruz | 2005-09-13 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6943434 | Method for maintaining solder thickness in flipchip attach packaging processes | Consuelo Tangpuz, Romel N. Manatad, Erwin Victor Cruz | 2005-09-13 |