Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6891256 | Thin, thermally enhanced flip chip in a leaded molded package | Rajeev Joshi | 2005-05-10 |
| 6867481 | Lead frame structure with aperture or groove for flip chip in a leaded molded package | Rajeev Joshi | 2005-03-15 |