Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6956098 | High modulus polyimide compositions useful as dielectric substrates for electronics applications, and methods relating thereto | John D. Summers, Richard F. Sutton, Jr. | 2005-10-18 |
| 6908685 | Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate | Kenji Uhara, Kouichi Sawasaki, Naofumi Yasuda, John D. Summers | 2005-06-21 |