Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6916544 | Laminate type materials for flexible circuits or similar-type assemblies and methods relating thereto | Hideki Moriyama, Meredith L. Dunbar, James R. Edman | 2005-07-12 |
| 6908685 | Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate | Kouichi Sawasaki, Naofumi Yasuda, Brian C. Auman, John D. Summers | 2005-06-21 |