Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6908685 | Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate | Kenji Uhara, Naofumi Yasuda, Brian C. Auman, John D. Summers | 2005-06-21 |