Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6917011 | Method and apparatus for decapping integrated circuit packages | Ming Hui Hong, Wen Dong Song, Zhihong Mai, Kok Tong Thiam, Chye Eng Soh | 2005-07-12 |
| 6897118 | Method of multiple pulse laser annealing to activate ultra-shallow junctions | Chyiu Hyia Poon, Byung Jin Cho, Alex See, Mousumi Bhat | 2005-05-24 |
| 6838637 | Method and apparatus for deflashing of integrated circuit packages | Wen Dong Song, Minghui Hong, Chengwu An | 2005-01-04 |