Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6917011 | Method and apparatus for decapping integrated circuit packages | Ming Hui Hong, Yong Lu, Zhihong Mai, Kok Tong Thiam, Chye Eng Soh | 2005-07-12 |
| 6838637 | Method and apparatus for deflashing of integrated circuit packages | Minghui Hong, Chengwu An, Yong Lu | 2005-01-04 |