Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6877933 | Pellet feeding system for a molding machine | Teng Hock Kuah, Jie Liu | 2005-04-12 |
| 6869556 | Molding system for semiconductor packages | Teng Hock Kuah, Jian Wu, Si Liang Lu | 2005-03-22 |
| 6860731 | Mold for encapsulating a semiconductor chip | Teng Hock Kuah, Man Ho Hui, Srikanth Narasimulau, Murali Sarangapani | 2005-03-01 |