JW

Jian Wu

AP Asm Technology Singapore Pte: 1 patents #6 of 23Top 30%
📍 Ottawa, CA: #100 of 418 inventorsTop 25%
Overall (2005): #174,591 of 245,428Top 75%
1
Patents 2005

Issued Patents 2005

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6869556 Molding system for semiconductor packages Shu Chuen Ho, Teng Hock Kuah, Si Liang Lu 2005-03-22