Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6860731 | Mold for encapsulating a semiconductor chip | Shu Chuen Ho, Teng Hock Kuah, Man Ho Hui, Murali Sarangapani | 2005-03-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6860731 | Mold for encapsulating a semiconductor chip | Shu Chuen Ho, Teng Hock Kuah, Man Ho Hui, Murali Sarangapani | 2005-03-01 |