Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6873032 | Thermally enhanced chip scale lead on chip semiconductor package and method of making same | David McCann, Paul R. Hoffman | 2005-03-29 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6873032 | Thermally enhanced chip scale lead on chip semiconductor package and method of making same | David McCann, Paul R. Hoffman | 2005-03-29 |