Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6873032 | Thermally enhanced chip scale lead on chip semiconductor package and method of making same | Richard L. Groover, Paul R. Hoffman | 2005-03-29 |
| 6838309 | Flip-chip micromachine package using seal layer | — | 2005-01-04 |