Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6919631 | Structures for improving heat dissipation in stacked semiconductor packages | David Zoba | 2005-07-19 |
| 6900527 | Lead-frame method and assembly for interconnecting circuits within a circuit module | Jeffrey Alan Miks, Kenneth Kaskoun, Markus K. Liebhard, Donald C. Foster, Frederic Bertholio | 2005-05-31 |
| 6873032 | Thermally enhanced chip scale lead on chip semiconductor package and method of making same | David McCann, Richard L. Groover | 2005-03-29 |