Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6856849 | Method for adjusting rapid thermal processing (RTP) recipe setpoints based on wafer electrical test (WET) parameters | Terrence J. Riley | 2005-02-15 |
| 6850322 | Method and apparatus for controlling wafer thickness uniformity in a multi-zone vertical furnace | Scott Bushman, Thomas J. Sonderman, Elfido Coss, Jr. | 2005-02-01 |