Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6939793 | Dual damascene integration scheme for preventing copper contamination of dielectric layer | Lu You, Christy Mei-Chu Woo | 2005-09-06 |
| 6878622 | Method for forming SAC using a dielectric as a BARC and FICD enlarger | Wenge Yang, Ramkumar Subramanian, Lewis Shen | 2005-04-12 |