Issued Patents 2004
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6831013 | Method of forming a dual damascene via by using a metal hard mask layer | Teng-Chun Tsai | 2004-12-14 |
| 6797190 | Wafer carrier assembly for a chemical mechanical polishing apparatus and a polishing method using the same | Art Yu, Shih-Hsun Hsu, Hsueh-Chung Chen | 2004-09-28 |
| 6709544 | Chemical mechanical polishing equipment | Shao-Chung Hu, Hsueh-Chung Chen, Shih-Hsun Hsu | 2004-03-23 |
| 6706140 | Control system for in-situ feeding back a polish profile | Shao-Chung Hu, Teng-Chun Tsai | 2004-03-16 |
| 6696361 | Post-CMP removal of surface contaminants from silicon wafer | Shao-Chung Hu, Teng-Chun Tsai, Yung-Tsung Wei | 2004-02-24 |