Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6828226 | Removal of SiON residue after CMP | Kei-Wei Chen, Kuo-Hsiu Wei, Yu-Kin Lin, Ying-Lang Wang, Shih-Tzung Chang | 2004-12-07 |
| 6769959 | Method and system for slurry usage reduction in chemical mechanical polishing | Kei-Wei Chen, Shih-Tzung Chang, Yu-Ku Lin, Ying-Lang Wang, Ming-Wen Chen +1 more | 2004-08-03 |
| 6682605 | Apparatus and method for removing coating layers from alignment marks | Aaron Cheng, Yu-Ku Lin, Chun-Chang Chen, Yi Wang | 2004-01-27 |