Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6784071 | Bonded SOI wafer with <100> device layer and <110> substrate for performance improvement | Yi-Ling Chan, Kuo-Nan Yang, Fu-Liang Yang, Chenming Hu | 2004-08-31 |
HC
Haur-Ywh Chen
Overall (2004): #214,799 of 270,089Top 80%
1
Patents 2004